Organisation Chain |
Department of Electronics and Information Technology(DeitY)||Centre for Development of Advanced Computing - DeitY||Benguluru - C-DAC - DeitY |
Tender Reference Number |
CDACB/RD24/181 |
Tender ID |
2025_DIT_864910_1 |
Withdrawal Allowed |
Yes |
Tender Type |
Open Tender |
Form Of Contract |
Supply |
Tender Category |
Goods |
No. of Covers |
2 |
General Technical Evaluation Allowed |
No |
ItemWise Technical Evaluation Allowed |
No |
Payment Mode |
Offline |
Is Multi Currency Allowed For BOQ |
No |
Is Multi Currency Allowed For Fee |
No |
Allow Two Stage Bidding |
No |
|
|
Offline |
1 |
Direct Credit |
2 |
R-T-G-S |
3 |
ECS |
4 |
NEFT |
|
|
|
|
|
1 |
Fee/PreQual/Technical |
Tender Acceptance letter (Annexure-A), Authority Letter (Annexure-B) |
.pdf |
|
|
Transaction details towards online payment of EMD / Valid exemption certificates |
.pdf |
|
|
A self-attested copy of Partnership deed / Memorandum and Articles of Association as applicable. |
.pdf |
|
|
Self-attested copies of GST registration certificate, PAN card |
.pdf |
|
|
Technical Bid - Duly filled compliance statements |
.pdf |
|
|
Self-Certification under preference to Make in India order as per Annexure - D |
.pdf |
|
|
Integrity Pact as per Annexure - E |
.pdf |
|
|
Copies of purchase orders and completion reports, as per eligibility criteria and any other document |
.pdf |
|
|
Audited financial statements or certified copies from a Chartered Accountant showing annual turnover |
.pdf |
|
|
Documentary evidence of having PCB assembly facility |
.pdf |
|
|
Valid ISO 9001 Certificate |
.pdf |
|
|
Declaration Letter - Bidders Financial Standing |
.pdf |
|
|
Declaration letter Bidder is not black listed by any State OR Central Government, Government Dept |
.pdf |
|
|
Unpriced Bid as per Section VI |
.pdf |
|
|
Undertaking from the supplier as per Annexure C |
.pdf |
2 |
Finance |
BoQ excel |
.xls |
|
|
|
|
|
|
|
|
Tender Fee in ₹
|
0.00 |
Fee Payable To |
Nil |
Fee Payable At |
Nil |
Tender Fee Exemption Allowed |
No |
|
|
EMD Amount in ₹
|
2,80,000 |
EMD Exemption Allowed |
Yes |
EMD Fee Type |
fixed |
EMD Percentage |
NA |
EMD Payable To |
Centre for Development of Advanced Computing |
EMD Payable At |
Bangalore |
|
|
|
|
|
|
Title |
PCB manufacturing, components procurement and Assembly |
Work Description |
PCB Manufacturing, Components Procurement,
Assembly, Testing and packing of 3000 Nos. of Indus IoT 1V3 Boards / Kits |
NDA/Pre Qualification |
As per Tender |
Independent External Monitor/Remarks |
NA |
Tender Value in ₹ |
NA |
Product Category |
Electronic Components And Devices |
Sub category |
PCB manufacturing, comp. procurement and assembly |
Contract Type |
Tender |
Bid Validity(Days) |
90 |
Period Of Work(Days) |
97 |
Location |
Bangalore |
Pincode |
560100 |
Pre Bid Meeting Place |
Bangalore |
Pre Bid Meeting Address |
Centre for Development of Advanced Computing
No.1, C-DAC Knowledge Park
Old Madras Road, Byappanahalli
Bengaluru - 560 038
|
Pre Bid Meeting Date |
26-Jun-2025 03:00 PM |
Bid Opening Place |
bangalore |
Should Allow NDA Tender |
No |
Allow Preferential Bidder |
No |
|
|
Published Date |
17-Jun-2025 06:15 PM |
Bid Opening Date |
09-Jul-2025 05:15 PM |
Document Download / Sale Start Date |
17-Jun-2025 06:20 PM |
Document Download / Sale End Date |
08-Jul-2025 05:00 PM |
Clarification Start Date |
17-Jun-2025 06:25 PM |
Clarification End Date |
24-Jun-2025 11:00 AM |
Bid Submission Start Date |
17-Jun-2025 06:30 PM |
Bid Submission End Date |
08-Jul-2025 05:00 PM |
|
|
NIT Document |
|
Download as zip file
|
Work Item Documents |
1 |
Tender Documents |
TenderDocume.pdf
|
Tender Document |
1305.40 |
2 |
BOQ |
BOQ_909287.xls
|
BoQ Excel |
243.00 |
|
|
|
|
Name |
Manager-Admin (MMG) |
Address |
CDAC, Knowledge Park, No. 1, Old Madras Road, Byappanahalli, Bengaluru 560038 |
|
|
|
|